Termalne paste

Spire Termalna pasta SP-420 0.3g

3.00KM

Thermal Impedance:<0.12CW
Thermal Conductivity:>2.93W/m-K
Colors: silver gray
Dimensions Injection tube: 55×8.5mm (wxd)
G.W. Weight: 0.3 Gram
Specific Gravity: >1.7
Bleed:<0.05%
Dialectric Constant:>5.1(100Hz)
Evaporation:<0.001%
Silicone Compounds: 50%m
Carbon Compounds: 30%
Metal Oxide Compounds: 20%
Application Thermal grease can be used on the rear side of the heatsink
Certifications ROHS
temperature of heating resist instantaneous: -50~240℃
Operation Temperture: -30~180℃

Spire Termalna pasta SP-700 0.5g

4.00KM

Thermal Impedance:<0.12CW
Thermal Conductivity:>2.93W/m-K
Colors: silver gray
Dimensions Injection tube: 55×8.5mm (wxd)
G.W. Weight: 0.5 Gram
Specific Gravity: >1.7
Bleed:<0.05%
Dialectric Constant:>5.1(100Hz)
Evaporation:<0.001%
Silicone Compounds: 50%m
Carbon Compounds: 30%
Metal Oxide Compounds: 20%
Application Thermal grease can be used on the rear side of the heatsink
Certifications ROHS
temperature of heating resist instantaneous: -50~240℃
Operation Temperture: -30~180℃

Spire Termalna pasta SP-456 1g

4.50KM

Thermal Impedance: <0.067CW-in2/W
Thermal Conductivity: >3.8W/m-K
Colors Silver Grey
Dimensions Injection tube: 51x20x12mm (w x l x h)
G.W. Weight: 1 Gram
Specific Gravity: >2.8
Bleed: <0.05%
Dialectric Constant: >5.1
Evaporation: 0.001%

Cooler Master Termalna Pasta HTK

9.00KM

HTK-002-U1-GP
Viskozitet: 1.400P (pri 25C)
Termalna provodljivost: 4.5 W/m-K
Termalna impedansa: 0.02 C-in/W
Namjena: Za centralne (CPU) i grafičke procesore (GPU).